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p ?2 0 w w ts z i n c b g e f e a p ty p roduct structur e 0 13 rohm co. w w.rohm.co.jp z 22111 ? 14? 0 n put c urre b d9060hf e neral desc r the bd90 6 frequency-fl built-in po w pressure. configurabl e input volta g accuracy of external sy n operation w correspond s e atures minima p-ch p o low dr o extern a soft st a built-in built-in p plications battery-po w etc.), comm equipment, pical appli c e silicon mon o , ltd. all rights r 0 01 volt a nt 2 a p-c bd 9 r iption 60hfp-c b d exible step-d w er mos f the opera t e with extern a g e range (5v 5% (f=200k h n chronization w ith external s to the cera m l external co m o wer mos f o pout:100% o a l synchroniz a a rt function: s o overcurrent p thermal shut d w ered in-vehic l unication suc h flat tv, print e c ation circu o lithic integrate d r eserved. a ge 5 . a 1ch 9 060f-c d 9060f-c a r own switchin f et which c a t ional frequ a l resistance. to 35v) and h z to 500khz ) input pin en a clock. the m ic capacitor. m ponents f et included i o n duty cycle a tion enabled o ft start time fi x rotection circ u d own protecti o l e unit (cluste h as etc, all f e r, dvd, av, o it d circuit thi . 0v t o ste p r e high-acc u g regulators a n withstand ency is f r it features a w a high frequ e ) . furthermor e a bles synchro n output cap a i n the packag e x ed to 2.7ms ( u it o n circuit r, car multim e f ields of indus o a i s product has n 1/30 o 35 v p -do w u racy with high r eely wide e ncy e , an n ous a citor e ( typ) e dia, s trial ke y pa c n o designed pr o v out w n d c y specificati o input v o output v output s selecta b oscillati powe r referen standb y operati n aec-q1 c kage hrp7 sop8 tection against tsz 0 put s c /dc o ns o ltage range: v oltage rang e s witch curren t b le oscillating n g frequenc y r mos fet o c e voltage a c y circuit curre n g temperatu r 00 qualified 9.395mm x 1 5.00mm x 6. 2 data radioactive ray s 0 2201-0t1t 30.aug s witc con v e : t: frequency: 5 y accurac y : (f=20 0 o n resistance : c curacy: e nt: r e range: - w(typ) x d 1 0.540mm x 2 20mm x 1.71 m data sh eet s 0al00080-1 .2013 rev.0 0 h v ert e 5v to 3 5 0.8v to vi n 2 a (m a 0 khz to 500k h 5 0 khz to 500k h : 0.6 ? (m a 2% (t y 0 a (t y 40c to +125 d (typ) x h(m a 2 .005mm m m eet -2 0 4 e r 5 v n v a x) h z 5 % h z) a x) y p) y p) c a x)
datasheet datasheet 2/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 block diagram, pin configuration, pin description pin no. pin name function 1 vin power supply input 2 sw output 3 fb error amp output 4 gnd ground 5 inv output cottage feedback 6 rt frequency setting resistor connection 7 en/sync enable/synchronizing pulse input fin - ground pin no. pin name function 1 vin power supply input (n o t e 1) 2 sw output 3 fb error amp output 4 inv output cottage feedback 5 en/sync enable/synchronizing pulse input 6 rt frequency setting resistor connection 7 gnd ground 8 pvin power supply input (note1) (note 1) pvin and vin are shorted (bd9060f-c) (bd9060hfp-c) sop8 (top view) 1 2 3 4 8 7 6 5 1 2 3 4 5 6 7 hrp7 (top view) 1 vin vreg vref uvlo tsd osc 6 sync 7 slope uvlo tsd pwm drv logic s r uvlo, tsd ocp, scp err 5 inv 0.8v soft start 3 fb scp 0.6v scp ocp ocp v in v in drv 2 rt gnd 4 sw en/sync v in v in 1 vin vreg vref uvlo tsd osc 6 sync 5 slope uvlo tsd pwm drv logic s r uvlo, tsd ocp, scp err 4 inv 0.8v soft start 3 fb scp 0.6v scp ocp ocp pv in pv in drv 8 2 rt gnd 7 sw pvin en/sync
datasheet datasheet 3/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 description of blocks ?err(error amp) the error amp block is an error amplifier used to input the reference voltage (0.8v (typ)) and the inv pin voltage. the output fb pin controls the switching duty and output voltage vo. these inv and fb pins are externally mounted to facilitate phase compensation. inserting a capacitor and resi stor between these pins enables adjustment of phase margin. (refer to recommended examples on p. 15 to 17) ? soft start the soft start block provides a function to prevent the overshoot of the output voltage vo th rough gradually increasing the normal rotation input of the error amplifier when power s upply turns on to gradually increase the switching duty. the soft start time is set to 2.7ms (typ). ? sync(en/sync) by making the ?en/sync? terminal less than 0.8v, the circuit can be shut down. furthermore, by applying higher frequency pulse than the configured oscilla tion frequency to the ?en/sync? pin, ex ternal synchronization is possible. frequency range of external synchronization is f osc x 1.05 f sync 500khz and 1.5 times of the set frequency. (refer to p. 11 ) ? osc (oscillator) this circuit generates the pulse wave to be inputted to the slope, and by connecting a resistor to the ?rt?, 50khz to 500khz oscillating frequency can be configured. (refer to p.15 figure 23) ?slope this block generates sawtooth waves from the clock generat ed by the osc. the generated sawtooth waves are sent to pwm. ?pwm the pwm comparator block is a comparator to make com parison between the fb pin and internal sawtooth wave and outputs a switching pulse. the switching pulse duty vari es with the fb value. (min duty width: 250ns) ? tsd (thermal shutdown) in order to prevent thermal destruction/thermal runway of the ic, the tsd block will turn off the output when the chip temperature reaches approximately 150c or more. when the chip temperature falls to a specified level, the output will be reset. however, since the tsd is designed to protect the ic, t he chip junction temperature should be provided with the thermal shutdown detection temperatur e of less than approximately.150c. ? ocp (over current protection) while the output power p-ch mos fet is on, if the volt age between drain and source (on-resistancexload current) exceeds the reference voltage internally set with the ic, oc p will start up.this ocpis a self-return type. if ocp operates, the duty will be small, and output voltag e will decrease. however, this protection circuit is only effective in preventing destruction from sudden accident. it does not support for continuous operation of the protection ci rcuit (e.g. if a load, which significantly exceeds the output curr ent capacitance, is normally connected) . furthermore, since the overcurrent protection detection value has negative temperatur e characteristics, consider thermal design. ? scp (short current protection) while ocp operates, and if the output volt age falls below 70%, scp will start up. if scp operates, the output will be turned off after a period of 1024 pulse. it extends the output off time to reduce the average output current. in addition, during power start-up, this feature is mask ed until it reaches the set output volt age to prevent wrong trigger of scp. ? uvlo (under voltage lock-out) uvlo is a protection circuit for low voltage malfunction. it preven tsmalfunction of the internal circuit at the time of sudden rise and fall of power supply voltage. it monitors the v in powersupply voltage and internal regulator voltage. if v in is less than 4.3v (typ), pch power mos fet out put is off. this threshold voltage has a hysteresis of 200mv (typ). if v in is more than 4.5v (typ) , uvlo will be released and the soft start circuit will be restarted. ? drv (driver) this is a driver circuit for driving the gate electrode of t he pch power mos fet output. by switching the driving voltage when the power supply voltage drop, it reduces the deterioration ofpower mos fet on-resistance. it monitors the v in power supply voltage and internal regulator voltage. if v in is less than 7.5v (typ), the dr iving voltage is switched.this threshold voltage has a hysteresis of 1.5v (typ).
datasheet datasheet 4/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 absolute maximum ratings (ta=25c) parameter symbol limits unit power supply voltage v in , pv in 42 v output switch pin voltage v sw v in v output switch current i sw 4 (note 1) a en/sync pin voltage v en/sync v in v rt,fb,inv pin voltage v rt ,v fb , v inv 7 v power dissipation hrp7 pd 5.51 (note 2) w sop8 pd 0.69 (note 3) w storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c (note 1) pd should not be exceeded. (note 2) reduce by 44mw/c,when mounted on 2-layerpcb of 70mmx70mmx16mm (pcb incorporates thermal via. copper foil ar ea on the reverse side of pcb: 10.5mmx10.5mm copper foil area on the reverse side of pcb: 70mmx70mm). (note 3) reduce by 5.52mw/c,when mounted on 1-layerpcb of 70mm x70mm x1.6mm caution: operating the ic over the absolute maximum ratings ma y damage the ic. in addition, it is impossible to predict all des tructive situations such as short-circuit modes, open circuit m odes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. recommended operating conditions parameter symbol limits unit operating power supply voltage v in , pv in 5 to 35 v operating temperature range topr -40 to +125 c output switch current i sw to 2 a output voltage (min pulse width) pw min 250 ns oscillating frequency fosc 50 to 500 khz oscillating frequency set resistance rt 27 to 360 k ? external sync frequency f sync f osc x 1.05 f sync f osc x 1.5 (note 1) khz (note 1) it should be configured at less than 500khz.
datasheet datasheet 5/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 electrical characteristics (unless otherwise specified, ta=- 40c to +125c, v in =13.2v,v en/sync =5v) parameter symbol guaranteed limit unit conditions min typ max standby circuit current i stb 0 5 a v en/sync =0v, ta=-40cto +105c circuit current i cc 3.7 8.0 ma i out =0a, rt=51k ? , v inv =0.7v sw block power mos fet on resistance r on 0.3 0.6 ? operating output switch current of overcurrent protection (note 1) i limit 2.5 4 a output leak current i oleak 0 5 a v in =35v, v en/sync =0v, ta=-40c to +105c error amp block reference voltage 1 v ref 1 0.784 0.800 0.816 v v fb = v inv reference voltage 2 v ref 2 0.780 0.800 0.820 v v fb = v inv , v in =5v to 35v reference voltage input regulation v ref 0.5 % v in =5v to 35v input bias current i b -1 a v inv =0.6v maximum fb voltage v fbh 2.0 2.5 v v inv =0v minimum fb voltage v fbl 0.51 0.80 v v inv =2v fb sink current i fbsink -2.45 -1.2 3 -0.45 ma v fb =1v, v inv =1v fb source current i fbsource 1.0 6.3 15.0 ma v fb =1v, v inv =0.6v soft start time (note 1) t ss 1.7 2.7 5.0 ms oscillator block oscillating frequency fosc 285 300 315 khz rt=51k ? frequency input regulation fosc 0.5 % v in =5v to 35v enable/sync input block output on voltage v enon 2.6 v v en/sync sweep up output off voltage v enoff 0.8 v v en/sync sweep down sink current i en/sync 19 60 a (note 1)this item is not 100% production tested. (caution) en / sync and rt are shorted at vin and en / sync short-circuited, ic is destroyed in vin 7v,
datasheet datasheet 6/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 typical performance curves figure 1. reference voltage vs temperature figure 2. oscillating fr equency vs temperature (rt=330k ? ) figure 3.oscillating frequency vs temperature (rt=160k ? ) figure 4.oscillating frequency vs temperature (rt=51k ? ) 0.784 0.788 0.792 0.796 0.800 0.804 0.808 0.812 0.816 -50-25 0 255075100125150 reference voltage:v ref [v] ambient temperature: ta [ c] 95 96 97 98 99 100 101 102 103 104 105 -50-25 0 255075100125150 oscillating frequency: f osc [khz] ambient temperature: ta [ c] rt = 160 k ? 47.5 48.0 48.5 49.0 49.5 50.0 50.5 51.0 51.5 52.0 52.5 -50-25 0 255075100125150 oscillating frequency: f osc [khz] ambient temperature:ta [ c] rt = 330 k ? 285 288 291 294 297 300 303 306 309 312 315 -50-25 0 255075100125150 oscillating frequency: f osc [khz] ambient temperature: ta [ c] rt = 51 k ?
datasheet datasheet 7/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 figure 5.oscillating frequency vs temperature (rt=30k ? ) figure 6.standby circuit current vs input voltage figure 7. circuit current vs input voltage figure 8.en/sync input cu rrent vs input voltage 475 480 485 490 495 500 505 510 515 520 525 -50-25 0 255075100125150 oscillating frequency: f osc [khz] ambient temperature: ta [ c] rt = 30 k ? 0 1 2 3 4 5 0 5 10 15 20 25 30 35 40 stand- by current: i stb [a] input voltage: vin [v] ta=125c ta=105c ta=25c, -40c 0 1 2 3 4 5 6 7 8 0 5 10 15 20 25 30 35 40 circuit current: i cc [m a] input voltage: v in [v] from top:ta=125c ta=25c ta=-40c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 20 25 30 35 40 en / sync input current: i en [ma] input voltage: v en / sync [v] inflection point from top:v en =6.2v(ta=125c) v en =6.5v(ta=25c) v en =6.7v(ta=-40c)
datasheet datasheet 8/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 figure 12.conversion efficiency vs output current (f=100khz) figure 9. on resistance vs output current (v in =5v) figure 10. on resistance vs output current (v in =13.2v) figure 11. on resistance vs output current (v in =35v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.00.51.01.52.0 fet on resistance: r on [] output current: l o [a] from top: ta=125c ta=25c ta=-40c v in = 13.2 v v in = 5 v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 fet on resistance: r on [ ? ] output current: l o [a] from top: ta=125c ta=25c ta=-40c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 fet on resistance: r on [ ? ] output current: l o [a] from top: ta=125c ta=25c ta=-40c v in =35 v 0 10 20 30 40 50 60 70 80 90 100 0.00.51.01.52.0 conversion efficiency[ ] output current:lo[a] from top: 5.0v output 3.3v output v in =13.2v f=100khz ta =25 c *it measured bd9060hfp.
datasheet datasheet 9/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 figure 13.conversion efficiency vs output current (f=300khz) figure 14.conversion efficiency vs output current (f=500khz) 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 conversion efficiency[ ] output current:lo[a] from top: 5.0v output 3.3v output v in =13.2v f=500khz ta =25 c *it measured bd9060hfp. figure 15.overcurrent prot ected operation current 0 2 4 6 8 10 012345 output current: l o [a] output voltage: v o [v] from left:ta=125c ta=25c ta=-40c v in = 13.2 v f = 300 khz v o = 5 v 0 10 20 30 40 50 60 70 80 90 100 0.00.51.01.52.0 conversion efficiency[ ] output current:lo [a] from top: 5.0v output 3.3v output v in =13.2v f=300khz ta =25 c *it measured bd9060hfp.
datasheet datasheet 10/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 timing chart ? basic operation ? over current protection operation v in =13.2v f=300khz v o =5v figure 17.timing chart (over current protection operation) v in fb sw v en / sync internal slope figure 16. timing chart (basic operation) sw i l v o inv fb internal soft start normal pulse repetition at the following auto reset (soft start operation) t off = 1024 / fosc [s] ex fosc = 300 khz t off = 3.41 ms t off, t ss terminal t ss = 2.7 [ms] (typ) t off t ss
datasheet datasheet 11/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 external synchronizing function in order to activate the external synchronizing function, connec t the frequency-setting resistor to the rt pin and then input a synchronizing signal to the en/sync pin. as the synchr onizing signal, input a pulse wave higher than a frequency determined with the setting resistor(rt).however, the external sync frequency should be configured between 1.05 to 1.5 times the set frequency. (frequency determined with rt x 1.05 external sync frequency frequency determined with rt x 1.5) (ex.) when the configured frequency is 300khz, the external sync frequency should be between 315khz to 450khz. furthermore, the pulse wave?s low voltage should be under 0.8v and the high voltage over 2.6v,(when the high voltage is over 6v the en/sync input current increases [refer to p.7 fig.8])the through rate of stand-up(and stand-down)under 20v/s. the duty of external sync pulse should be configured between 20% to 80%. figure 18.external sync sample circuit (v o =5v,i o =1a,f=300khz,en/sync=450khz) cbulk c in rt 51 k? r3 10k ? r2 8.2 k ? r1 43k ? r4 0k ? c o 22f d1 v in en/sync v o i l vin/pvin rt en/sync sw inv fb bd9060hfp-c bd9060f-c c2 1000pf c o 22f v en/snc = 0v to 5 v f = 450 khz sr = 20 v / s duty = 50 % c1 4700pf c3 100pf gnd
datasheet datasheet 12/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 selection of components externally connected necessary parametersare as followsin designingthe power supply. parameter symbol specificationcase input voltage v in 8v to 33v output voltage v o 5v output ripple voltage v pp 20mvp-p input range i o min 0.5a / typ1.0a / max 1.5a switching frequency f sw 300khz operating temperature ra nge topr -40cto+125c 1. setofoutputinductor l constant in dc/dc converter, to supply electric curr ent continuously to the load, the lc filter is necessary for the smoothness of the output voltage. i l that flows to the inductor becomes small when a big inductor of the inductanc e value is selected, and the voltage of the output ripple becomes small. it is a trade-off against the respons iveness, the size and the cost of the inductor. the inductance value of the inductor is shown in the next expression. ? ???(a) (v in(max) :maximum input voltage, i l :inductor ripple current) i l is set to make sw the continuous control action (i l keeps continuously flowing) usua lly.the condition of thecontinuous operation is shown in the next expression. ???(b) (i o :load current) fi g ure 19.a pp lication sam p le circuit figure 20. continuous action figure 21. discontinuous action cbulk c in r4 v in en/sync v o i l vin/pvin rt en/sync sw inv fb bd9060hfp-c bd9060f-c c2 r1 r2 co d1 c1 r3 c3 rt gnd sw v t i t io i l sw v t i t io
datasheet datasheet 13/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 i o figure 22.overcurrentdetection i limit i o the smaller the i l , the inductor core loss(iron loss) and loss due to esr of the output capacitor, v pp will be reduced. v pp is shown in the next expression. ? ? ? ???(c) (esr: equivalent series resistance of output capacitor, c o : output condenser capacity) i l is set to approximately 10% to 40% of i o . generally, even if i l is somewhat large, v pp of the target is satisfied because the ceramic capacitor has super-low esr. in that case, it is also possible to use it by the discontinuous action. the inductance value of the inductor can be set small as an advantage. it contributes to the miniaturization of t he set because of the large rated current, sm all inductor is possible if the inductan ce value is small.the disadvantagesare the increase in core lo sses in the inductor, the decrease in maximum output current, and the deterioration of ther esponse. when other capacitors (electroly tic capacitor, tantalum capacitor, and electroconductive polymer etc) are used for output capacitor c o ,check theesrfromthe manufacturer's data sheetand determine the i l to fitwithin the acceptable range of v pp .especially inthe case ofelectrolytic capacitor, because the capacity decrease at the low temperature is remarkable, v pp increases. when using capacitor at the low temperature, it is necessary to note this.the maxi mum output electric current is limited to t he overcurrent protection working current as shown in the next expression. ? ???(d) where: i o(max) is maximum output current, i limit(min) :minimum operating output switch curre nt of overcurrent protection2.5a the shield type (closed magnetic circuit type) is the re commended type of inductor. there is no problem in the open magnetic circuit type if the application is low cost and does not consider noise.in t hat case, there is magnetic field radiatio n between the parts.there should be enough space between the parts. for ferrite core inductor type, in particular, please note the magn etic saturation.it is necessary not to saturate the core in allcases.care must be taken giventhe provis ions of thecurrent rating because it differs according to each manufacturer. pleaseconfirm the rated current at t he maximum ambient temperature of t he application to the manufacturer. 2. setofoutputcapacitor c o constant the output capacitor is selected on the basis of esr that is required from the expression (c). v pp can be reduced by using a capacitor with a small esr.the ceramic capacitor is the best selection that meets this requirement.the ceramic capacitor contributes to the mi niaturization of the set because it has sma ll esr.please confirm frequency characteristic of esr from the datasheet of t he manufacturer, and select the one that esr in the switching frequency used is low.it is necessary to note the ceramic capacitor because the dc biasing characteristic is remarkable. for the voltage rating of the ceramic capacitor, twice or more of the maximum output voltage is usually required.by select ing those high voltage rating, it is possible to reduce the influence of dc bias characteri stics.moreover, in order to maintain good temperature characteristics, the one with the charac teristic of x7r and x5r or more is recommended.because the voltage rating of a mass ceramic capacitor is low, the selection becomes difficul t in the application with high output voltage. in that case, please select electrolytic capacitor. please select the one wi th voltage rating of 1.2 time s or more of the output voltage when you use electrolytic capacitor.electrolytic capacitors are high blocking voltage, a large capacity, and the little dc biasing characteristic, and are generally cheap.because main fa ilure mode is open, it is effective to use electrolytic capacitor selection in the application when reliability is dema ndedsuch as in-vehicle. there are disadvantages as, esr is relatively large, and decrease of capacity at low temperatures.it is necessary to note this so that the low te mperature, and in particular, v pp may increase.moreover, the feature of this capacitor is to define t he lifetime because there is possible dry up. a very excellent characteristic of the tantalum capacitor and the elec tro-conductive polymer is the thermal characteristic unlike the electrolytic capacitor.the design is facilitated because there is littl e dc biasing characteristic li ke the electrolytic capacitor.typically, for voltage rating, a tantalum capacitor is selected tw ice the output voltage, and for conductive polymer is selected 1.5 times more than the output voltage.the disadvantage of t he tantalum capacitor is that the failure mode is short, and the breakdown voltage is low.it is not generally selected in the applicat ion that reliability such as in-vehicle is demanded.the disadvantage of the electroconductive polymer is that the failure mode is short(short happens by accident chiefly, though it is open),the breakdown voltage is low , and generally expensive.although in most cases ignored, these capacitors are rated in ripple current. the rms values of the ripple electric current obtained in the next expression mu st not exceed the ratings ripple electric current. t
datasheet datasheet 14/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 ? ???(e) where:i co(rms) is rms value of the ripple electric current in addition,with respect toc o , choose capacitance value lessthan the valueobtainedby the following equation. . ???(f) where: i limit(min) is ocp operation output switch curre nt(min) 2.5a,1.7ms: soft start time(min) there is a possibility that boot failure happens when the limits from the above-mentione d are exceeded.especiallyif thecapacitance valueis extremely large, you may activate over-current protecti onby theinrush currentat startup, and theoutputdoes not start. please confirm this well on the actual circuit.the capacitance value is an important parameter that decides the lc resonant frequency. for stable tr ansient response, the loop is dependent on the c o .please select after confirming the setting of the phase compensation circuit. 3. setting constant of capacitor c in / c bulk input the input capacitor is usually required for two types of decoupling: capacitorsc in and bulk capacitorsc bulk .ceramic capacitor 1f to 10f is necessary for the decoupling capacitor.ceramic capacitor is effective by being placed as close as possible to the vin pin.voltage rating is recommended to mo re than 1.2 times the maximum input voltage, or twice the normal input voltage.about the bulk capaci tor, the decrease in the line voltage is prevented, and the ro le of the backup power supply to keep the input potential constant is realized. the low esr electrolytic capacitor with large capacity is suitable for the bulk capacitor.it is nece ssary to select the best capacitance va lue as per set applic ation.when impedance on the input side is high because wiring from the power supply to vin is long, etc., then high capacitance is needed.in actual use conditions,it is necessary to verify that there is no problem when ic operation turns off the output due to the decrease of v in at transient response.in that case, please be careful not to exceed the rated ripple current of the capacitor. the rms value of the input ripple electric current is obtained in the next expression. ???(g) where: i cin(rms) is rms value of the input ripple electric current in addition, in automotive and other applic ations requiring reliability, it is reco mmended that capacitors are connected in parallel to accommodate a multiple of elec trolytic capacitors minimal dry up chances.we will recommend making it to two series + two parallel structures to decrease the risk of the ceramic capacitor by short destruction.the line has been improved to the summary respectively by 1pack in each capacitor manufacturer and confirms two series and two parallel structures to each manufacturer. 4. setting output voltage output voltage is governed by the following equation. 0.8 ???(h) please set return resistance r2 below 30k ? to reduce the error margin by the bias current.in addition, since power efficiency is reduced with a small r1 + r2, please set the current flowing through the feedba ck resistor to be small enough than the output current i o . 5. selectionof the schottky barrier diode the schottky barrier diode that has small forward voltage and short reverse recovery time is used for di.an important parameter for selecting it is an average rectified current and a direct current inve rse-direction voltage.average rectified current i f(avg) is obtained in the next expression. ???(i) where: i f(avg) isaverage rectified current
datasheet datasheet 15/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 the absolute maximum rating of the schottky barrier diode rectified current average is more than 1.2 times i f(avg) and the absolute maximum rating of the dc reverse voltage is greater than or equal to 1. 2 times the maximum input voltage. the loss of di is obtained in the next expression. ???(j) where: vf is forward voltage in i o(max) condition selecting a diode that has small forward voltage, and has short reverse recovery time is highly effective.please select the 0.6v max for the forward voltage. please note that there is possibility of the inte rnal element destruction when a diode with larger vf than this is used.because the reverse recovery time of the schottky barrier diode is so shortthat it is possible to disregard, the switching loss can be disr egarded. when it is necessary that the diode endures in the state of the output short-circuit, power dissipation ratings and the heat radiation ability are needed in addition. the rated current is required about 1.5 times the overcurrent detection value.the loss when the output is short-circuited is obtained in the next expression. ???(k) where: i limit(max) isocp operation output switch current(max) 6a 6. setting the oscillating frequency an internal oscillating frequency can be set by the resistance connected with rt. the range that can be set is 50khz to 500khz, and the relation between resistance and the oscillation frequency is decided as s hown in the figure below.when setting beyond this range, there is a possibility of non-oscillation and ic operation cannot be guaran teed. 7. setting the phase compensation circuit a high response performance is achieved by setting 0db crossing frequency fc of the total gain (frequency at the gain 0db) high.however, you need to be aware of the relationship to be a trade-off between stability.moreover, dc/dc converter application is sampled by swit ching frequency, and should suppress the gain in switching frequency.it is necessary to set 0db crossing frequency to 1/10 or less of the switching frequency.in summary,target these characteristics with the application as follows. ? when thegain is 1(0db), phase lagis less than or equal to135 ? (more than45 ? phase margin). ? 0db crossing frequency is 1/10 times or le ss of the switching frequency.to improve the responsiveness, higher frequency of switching frequency is needed. we recommend the bode diagram to be made by using the tr ansfer function of the control loop to obtain frequency characteristic of target for the phase compensation circuit.make sure the frequency characteristics of the total gain by totaling the transfer functi on of the following three. rt[k ? ] fosc[khz] rt[k ? ] fosc[khz] 27 537 100 160 30 489 110 146 33 449 120 134 36 415 130 124 39 386 150 108 43 353 160 102 47 324 180 91 51 300 200 82 56 275 220 75 62 250 240 69 68 229 270 61 75 209 300 55 82 192 330 50 91 174 360 46 figure 23.oscillating frequency vs rt graph'svalue is typical and you need to consider thevariationof5% respectively. 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 oscillating frequency:f osc [khz] oscillating frequency setting resistance:rt[k ? ]
datasheet datasheet 16/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 ???(l) ???(m) ? ???(n) where: g lc is transfer functionof thelcresonance g fb is transfer functionof thephase compensation g pwm is transfer functionof thepwm, v ramp 0.7v because bd9060hfp-c/bd9060f-c is a vo ltage mode control, two poles and tw o zeroes of the phase interpolator circuitshown in the figure below can be added.necessary frequ encies of poles and zeroes are obtained in the following. ???(o) ???(p) ???(q) ???(r) ???(s) ???(t) where: dcr isdcresistanceof the inductor r o isload resistance frequency response is optimized by placing the appropriate frequency of these poles and zeros.the standard is as follows. figure 24. phase compensation circuit v o d1 sw dcr l esr co r4 c2 r1 r2 inv fb c3 c1 r3 vref
datasheet datasheet 17/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 0.2 ???(u) 0.5 2 ???(v) 0.5 ??? (w) ??? (x) the phase delays (-180) by the lc resonance can be canceled by setting the phase amends as mentioned above . fp2is not necessary if f esr is higher than the sw frequency (the ceramic capac itor that has low esr is used for the output capacitor).in addition, if q(quality fact or)of the lc filter is high,the gain may peak out, and phase margin can not be secured sufficiently.when q is high, f z1 and f z2 are brought close to f lc as much as possible. q is obtained in the next expression. ??? (y) ???(z) the setting method by above-mentioned conditional expression is suitable as the starting point of the phase amends.please confirm that you meet the frequency characteristics to create a bode plot.actually, the frequency characteristic changes are greatly affected by the type and the conditio n (temperature, etc. ) of parts that are used, and the wire routing and layout for the pcb.for instance, the lc resonance point moves because of the capac ity decrease at low temperature and an increase of esr when electrolytic capacitor is used for the output capacit or that there is even possibility of oscillation.to c1, c2 and c3 for phase compensation capacitor,use of ch products or temperature compensation type c0 g, etc. with an excellent thermal characteristic are recommended. please confirm stability and responsiveness in actual equipment. to check on the actual frequency characteristics, use a fr a or a gain-phase analyzer.mor eover, the method of observing the degree of change by the loading response can be done, w hen these measuring instrum ents do not exist.the response is low when the output is made to change under no load to maximum load, and there is a lot of variat ion quantities.it can be said that the phase margin degree is low when there is a lo t of ringing frequencies after it changes, usually two times or more of ringing as standard. however, a quanti tative phase margin degree cannot be confirmed. 0 load t adequate phase margin. figure 25. load response maxi mum output volta g e inadequate phase margin
datasheet b d ?2 0 w w ts z a p datasheet d 9060hf p 0 13 rohm co. w w.rohm.co.jp z 22111 ? 15? 0 p plication e x no r1 r2 r3 r4 rt c1 c2 c3 c in c o c bulk l d 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 efficiency[%] out cbulk v in en/sync conver s datasheet p -c bd9 0 , ltd. all rights r 0 01 x amples pa input voltag e output volt a output ripp l output curr e switching f r operating t e packag e 1005 1005 1005 1005 1005 1005 1005 1005 3216 3216 10x10x3.8( m cpd 1.0 1.5 2 put current:io[a] c in rt s ion efficienc y datasheet 0 60f-c r eserved. rameter e a ge l e voltage e nt r equency e mperature e p a 43k ? , 8.2k ? 10k ? , 0k ? , 51k ? , 470 100 0 100 p 2.2 22 f 22 0 m m 3 ) avera g 2 .0 vin/p v rt en/s y b d y outp u v o 10mv / v in =13. 2 io=1.0a datasheet s y t a rameters , 1%, 1/16w , 1%, 1/16w , 1%, 1/16w 1%, 1/16w , 1%, 1/16w 0 pf,r,50v 0 pf,ch,50v p f,ch,50v f, x 7 r . 5 0 v f ,x7r,16v 0 fx2,35v 33 h g e i = 6a max figure 26. a v i n y n c d 9060hfp-c gnd u t ripple volt a / div @ ac 1. 6 2 v tektronix m datasheet 18/30 y mbol v in v o v pp i o f sw topr part name ( mcr01 s mcr01 s mcr01 s mcr01 s mcr01 s gcm s e gcm s e gcm s e gcm s e gcm s e cz ser clf10040 rb095 b a pplication e x fre q sw inv fb d1 a ge 6s/div m so5204 v in = io= 1 datasheet s p min 0.5 a - 4 series) s eries s eries s eries s eries s eries e ries c e e ries c e e ries c e e ries c e e ries c e i es ele c series b -40 s x amples 1 q uency char a i l co c1 r3 c3 = 13.2v 1 .5a datasheet tsz 0 p ecificationca s 8v to 28v 5v 20mvp-p a / typ 1.0a / m 300khz 4 0cto+125 c type chip resistor s chip resistor s chip resistor s chip resistor s chip resistor s e ramic capacit o e ramic capacit o e ramic capacit o e ramic capacit o e ramic capacit o c trolytic capa c coil s chottky diod e a cteristics co n f fra5087 datasheet 0 2201-0t1t 30.aug s e m ax 1.5a c manu f s r o s r o s r o s r o s r o t ors mu r t ors mu r t ors mu r t ors mu r t ors mu r c itors nic h t d e s r o v in =13.2v io step1.0a to 1.5 a v o 50mv/div @ ac io 400ma/div @ d c t e r4 c2 r1 r2 load c datash e datasheet 0al00080-1 .2013 rev.0 0 acturer o hm o hm o hm o hm o hm r ata r ata r ata r ata r ata h icon d k o hm a c 200s/div e ktronix mso5204 v o c hange e et datasheet -2 0 4
datasheet b d ?2 0 w w ts z datasheet d 9060hf p 0 13 rohm co. w w.rohm.co.jp z 22111 ? 15? 0 no r1 r2 r3 r4 rt c1 c2 c3 c in c o c bulk l d cbulk v in en/sync 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 efficiency[%] out conver s datasheet p -c bd9 0 , ltd. all rights r 0 01 pa input voltag e output volt a output ripp l output curr e switching f r operating t e packag e 1005 1005 1005 1005 1005 1005 1005 1005 3216 3216 10x10x3.8( m pmds c in rt 0.4 0.6 0.8 put current:io[a] s ion efficiency datasheet 0 60f-c r eserved. rameter e a ge l e voltage e nt r equency e mperature e p a 47k ? , 15k ? , 8.2k ? 0k ? , 51k ? , 470 0 820 p 100 p 2.2 f 22 f 22 m m 3 ) avera g vin/p v rt en/s y b 1.0 v o 10mv/ d v in =13. 2 io=0.4a out p datasheet s y t a rameters , 1%, 1/16w , 1%, 1/16w , 1%, 1/16w 1%, 1/16w , 1%, 1/16w 0 pf, r, 50v p f, ch, 50v p f, ch, 50v f , x7r, 50v f , x7r, 16v 0 f, 50v 33 h g e i = 2a max figure 27. a v i n y n c b d9060f-c gnd d iv @ ac 2 2 v tektronix t d p ut ripple volt datasheet 19/30 y mbol v in v o v pp i o f sw topr part name ( mcr01 s mcr01 s mcr01 s mcr01 s mcr01 s gcm s e gcm s e gcm s e gcm s e gcm s e cd se r clf6045 s rb060 l a pplication e x sw inv fb d1 g a v in = io= 0 fre q s/div d s5034b t age datasheet s p min 0.1 a - series) s eries s eries s eries s eries s eries e ries c e e ries c e e ries c e e ries c e e ries c e ies ele c s eries l -40 s x amples 2 i l co c1 r3 c3 p h a in = 13.2v 0 .8a q uency char a datasheet tsz 0 p ecificationca s 5 v to 16v 3.3v 20mvp-p a / typ 0.4a / m 300khz - 40cto+85 c type chip resistor s chip resistor s chip resistor s chip resistor s chip resistor s e ramic capacit o e ramic capacit o e ramic capacit o e ramic capacit o e ramic capacit o c trolytic capa c coil s chottky diod e ase n f fra5087 cteristics v datasheet 0 2201-0t1t 30.aug s e m ax 0.8a c manu f s r o s r o s r o s r o s r o t ors mu r t ors mu r t ors mu r t ors mu r t ors mu r c itors nic h t d e s r o r4 c2 r1 r2 v o 50mv/div @ ac io 200ma/div @ d c v in =13.2v io step 0.4a to 0.8 a te load c datash e datasheet 0al00080-1 .2013 rev.0 0 acturer o hm o hm o hm o hm o hm r ata r ata r ata r ata r ata h icon d k o hm v o c 200s/div ktronix tds5034b c hange e et datasheet -2 0 4
datasheet datasheet 20/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 input filter the input filter circuit for emc m easures is depicted in figure 28. the type filters are the third lc filters. when the decoup ling capacitor for high frequency is insufficient, it uses type filters. because a large attenuation characterist ic is obtained, an excellent characteri stic can be obtained as an emi filter. tvs(transientvoltagesuppressors) is used for the first protection of the in-vehicle powe r supply line.because it is necessary to endure high energy that dumps the load, a general zener diode is insufficient. the following are recommended. to protect it when the power supply such as battery is accidentally c onnected in reverse, reverse polarity protection diode is needed. recommended parts manufacturer list show the parts manufacturer for the recommended reference. no part name (series) manufacturer l clf series tdk xal series coilcraft c cj series nichicon cz series nichicon tvs sm8 series vishay d s3a thru s3m series vishay device type manufacturer url c electrolytic capacitors nichicon www.nichicon.com c ceramic capacitors murata www.murata.com l coils tdk www.global.tdk.com l coils coilcraft www.coilcraft.com l coils sumida www.sumida.com d diodes vishay www.vishay.com d diodes/resistors rohm www.rohm.com figure 28. frequency characte r istics bd9060hfp-c bd9060f-c l cc -type filter tvs d reverse polarity protection diode c c c c c c c c
datasheet datasheet 21/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 v in v o r1 r4 c2 r2 c in d1 l1 c1 c3 r3 c o rt gnd c bulk directions for pattern layout of pcb 1. arrange the wirings shown by wide lines as short as possible in a broad pattern. 2. locate the input ceramic capacitor c in as close to the vin-gnd pin as possible. 3. locate the r t as close to the gnd pin as possible. 4. locate the r1 and r2 as close to the inv pin as possible, and provide the shortest wiring fr om the r1 and r2 to the inv pin. 5. locate the r1 and r2 as far away from the l1 as possible. 6. separate power gnd (schottky diode, i/o capacitor`s gnd) and signal gnd (r t ,gnd), so that sw noise doesnot have an effect on signal gnd at all. 7. design the power wire line as wide and short as possible. figure 29. filter circuit diagram (bd9060hfp-c) figure 31. bd9060hfp-c reference layout pattern * please make gnd to cover the wide area with no parts. * gray areas mean gnd in the above layout pattern. l1 co c2 r4 r3 c3 r1 r2 rt c28 cin d1 c1 figure 30. application circuit (bd9060f-c) bd9060hfp gnd r2 power gnd c1 r3 signal gnd vin sw fb gnd inv rt en/sync d1 cbulk c in co l d a d r1 r4 c2 c3 r t l1 bd9060f r2 power gnd c1 r3 signal gnd vin sw fb inv rt en/sync d1 cbulk c in co l d a d r1 r4 c2 c3 r t gnd pvin l1 figure 32. bd9060f-c reference layout pattern c bulk
datasheet datasheet 22/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 power dissipation for thermal design, be sure to operate the ic within the following conditions. (since the temperatures described hereunder are all guaranteed temperature, take margin into account.) 1.the ambient temperature ta is to be 125c or less. 2.the chip junction temperature tj is to be 150c or less. the chip junction temperature tj can be considered in the following two patterns: c 1. to obtain tj from the ic surface temperaturetc in actual use reference value jc : hrp7 7 c /w jc : sop8 32.5 c /w 2. to obtain tj from the ambient temperature ta reference value ja : hrp7 125.0 c /w single piece of ic 54.3 c /w 2-layer pcb (copper foil area on the front side of pcb : 15mm15mm) 22.7 c /w 2-layer pcb (copper foil area on the front side of pcb : 70mm70mm) 17.1 c /w 4-layer pcb (copper foil area on the front side of pcb : 70mm70mm) pcb size: 70mm70mm1.6mm (pcb incorporates thermal via) copper foil area on the front side of pcb: 10.5mm10.5mm ja : sop8 222.2 c /w single piece of ic 181.3 c /w 1-layer pcb(copper foil area on the front side of pcb : 70mm70mm) the heat loss w of the ic can be obtained by the formula shown below: w where: r on is the on resistance of ic (refer to page.8) io isthe load current v o isthe output voltage v in istheinput voltage i cc isthe circuit current(refer to page.5) tr isthe switching rise/fall time (approximately 15n/35ns) fis the oscillating frequency 2 1 2 1 figure 33. sw waveform
datasheet datasheet 23/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 i/o equivalent circuit figure 34. i/o equivalent circuit inv v in 1k internal regulator rt v in 167k internal regulator en / sync sw rt fb inv sw v in v in (bd9060hfp-c) internal regulator 222k v in en/sync 145k 221k 60
datasheet datasheet 24/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity whenconnecting the power supply, such as mounting an external diode between the power supply and the ic?s powersupply terminals. 2. power supply lines design the pcb layout pattern to provide low impe dance ground and supply lines. separate the ground and supplylines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affectingthe analog block. furthermore , connect a capacitor to ground at all power supply pins. consider the effect oftemperature and aging on the capacitance va lue when using electrolytic capacitors. 3. ground voltage the voltage of the ground pin must be the lowest voltage of all pins of the ic at all operat ing conditions. ensure that nopins are at a voltage below the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current gnd trac es, the two ground traces should be routed separately butconnected to a single ground at the reference point of the application board to av oid fluctuations in the small-signalground caused by large currents. also ensure th at the gnd traces of extern al components do not cause variations onthe gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperatur e of the chip may result indeterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is whenthe ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating,increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained.the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrushcurrent may flow instantaneously due to the internal powering sequence and delays, especially if the ichas more than one power supply. therefore, give special consideration to power coupling capacitance,power wiring, width of gnd wiring, and routing of connections. 8. operation under str ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin maysubject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supplyshould always be turned off completely before conn ecting or removing it from the test setup during the inspectionprocess. to prevent damage from static discharge, ground the ic during assembly and use similar precautions duringtransport and storage. 10. inter-pin short and mounting errors ensure that the direction and position ar e correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground. inter-pin shorts could be due to many reasons such as metal particles, water droplet s (in very humid environment) and unintentional solder bridgedeposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the ga te of a cmos transistor. the gate has extremely high impedanceand extremely low capacitance. if left unconnected, the electric fi eld from t he outside can easily charge it. the smallcharge acquired in this way is enough to produ ce a significant effect on the conduction through the transistor andcause unexpected operation of ic. so unless ot herwise specified, input terminals not being used should be connectedto the power supply or ground line.
datasheet datasheet 25/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep themisolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating aparasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutualinterference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes tooperate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should beavoided. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectr ic constant considering the change of capacitance withtemperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that t he output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic incorporates and integrated thermal shutdown circuit to prevent heat damage to the ic. normal operationshould be within the power dissipation rating, if how ever the rating is exceeded for a continued period, the junctiontemperature (tj) will rise and the tsd circuit will be activated and turn all output pins off. after the tj falls below thetsd threshold the circuits are automatically restored to normal operation.note that the tsd circuit operates in a situation that exceeds the absolute maximum rating s and therefore, under nocircumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic fromheat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. thisprotection circuit is effective in preventing damage d ue to sudden and unexpected incidents. however, the ic shouldnot be used in applications characterized by contin uous operation or transitioning of the protection circuit.
datasheet datasheet 26/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 ordering information b d 9 0 6 0 h f p - c t r rohm model name package type hfp : hrp7 f : sop8 product grade automotive tape and reel information tr: reel type embossed taping (hrp7) e2: reel type embossed taping (sop8) marking diagram hrp7(top view) bd9060hfp part number marking lot number 1pin mark sop8(top view) d9060 part number marking lot number 1pin mark
datasheet datasheet 27/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 thermal reduction characteristics hrp7 sop8 : single piece of ic : mounted on a rohm standard board board size : 70mm70mm1.6mm 2.3 w 1.0 w 5.5w 7.3w 0 1 2 3 4 5 6 7 8 9 10 0 255075100125150 power dissipation: pd[w] ambient temperature: ta[c] 0.69w 0.56 w 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 255075100125150 power dissipation: pd[w] ambient temperature: ta[ c] figure 34. figure 38. thermal reduction characteristics : single piece of ic board size: 70mm70mm1.6mm (with thermal via on the board) copper area: 10.5mm 10.5mm : 2-layer pcb (copper foil area on the reverse side of pcb: 15mm15mm) : 2-layer pcb (copper foil area on the reverse side of pcb: 70mm70mm) : 4-layer pcb (copper foil area on the reverse side of pcb: 70mm70mm)
datasheet b d ?2 0 w w ts z p h p datasheet d 9060hf p 0 13 rohm co. w w.rohm.co.jp z 22111 ? 15? 0 h ysical dim e p ackage n a datasheet p -c bd9 0 , ltd. all rights r 0 01 e nsion, tap e a me datasheet 0 60f-c r eserved. e and reel i datasheet nformation datasheet 28/30 h r datasheet r p7 datasheet tsz 0 datasheet 0 2201-0t1t 30.aug datash e datasheet 0al00080-1 .2013 rev.0 0 e et datasheet -2 0 4
datasheet datasheet 29/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin figure 35. thermal reduction characteristics
datasheet datasheet 30/30 bd9060hfp-c bd9060f-c tsz02201-0t1t0al00080-1-2 ?2013 rohm co., ltd. all rights reserved. 30.aug.2013 rev.004 www.rohm.co.jp tsz22111 ? 15? 001 revision history date revision changes 2013.08.30 004 new release
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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